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 PD -95597
IRG4IBC30KDPBF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE
Features
High switching speed optimized for up to 25kHz with low VCE(on) Short Circuit Rating 10s @ 125C, V GE = 15V Generation 4 IGBT design provides tighter parameter distribution and higher efficiency than previous generation IGBT co-packaged with HEXFRED TM ultrafast, ultra-soft-recovery anti-parallel diodes for use in bridge configurations Industry standard TO-220 FULLPAK Lead-Free
C
Short Circuit Rated UltraFast IGBT
VCES = 600V
G E
VCE(on) typ. = 2.21V
@VGE = 15V, IC = 9.2A
n-channel
Benefits
Generation 4 IGBTs offer highest efficiencies available maximizing the power density of the system IGBT's optimized for specific application conditions HEXFREDTM diodes optimized for performance with IGBTs. Minimized recovery characteristics reduce noise EMI Designed to exceed the power handling capability of equivalent industry-standard IGBT
Absolute Maximum Ratings
Parameter
VCES IC @ TC = 25C IC @ TC = 100C ICM ILM IF @ TC = 100C IFM tsc VISOL VGE PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Diode Continuous Forward Current Diode Maximum Forward Current Short Circuit Withstand Time RMS Isolation Voltage, Terminal to Case, t = 1 min Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting Torque, 6-32 or M3 Screw.
TO-220 FULLP AK
Max.
600 17 9.2 34 34 9.2 34 10 2500 20 45 18 -55 to +150 300 (0.063 in. (1.6mm) from case) 10 lbfin (1.1 Nm)
Units
V
A
s V W C
Thermal Resistance
Parameter
RJC RCS RJA Wt Junction-to-Case - IGBT Junction-to-Case - Diode Junction-to-Ambient, typical socket mount Weight
Typ.
2.0 (0.07)
Max.
2.8 3.7 65
Units
C/W g (oz)
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1
7/27/04
IRG4IBC30KDPBF
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
VCE(on)
VGE(th) VGE(th)/TJ gfe ICES VFM IGES
Parameter Min. Typ. Max. Units Collector-to-Emitter Breakdown Voltage 600 V Temperature Coeff. of Breakdown Voltage 0.54 V/C Collector-to-Emitter Saturation Voltage 2.21 2.7 2.88 V 2.36 Gate Threshold Voltage 3.0 6.0 Temperature Coeff. of Threshold Voltage -12 mV/C Forward Transconductance 5.4 8.1 S Zero Gate Voltage Collector Current 250 A 2500 Diode Forward Voltage Drop 1.4 1.7 V 1.3 1.6 Gate-to-Emitter Leakage Current 100 nA
Conditions VGE = 0V, IC = 250A VGE = 0V, IC = 1.0mA IC = 16A VGE = 15V See Fig. 2, 5 IC = 28A IC = 16A, TJ = 150C VCE = VGE, IC = 250A VCE = VGE, IC = 250A VCE = 100V, IC = 16A VGE = 0V, VCE = 600V VGE = 0V, VCE = 600V, TJ = 150C IC = 12A See Fig. 13 IC = 12A, TJ = 150C VGE = 20V
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Qg Qge Qgc t d(on) tr td(off) tf Eon Eoff Ets tsc t d(on) tr t d(off) tf Ets LE Cies Coes Cres trr Irr Qrr di(rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge Diode Peak Rate of Fall of Recovery During tb Min. 10 Typ. Max. Units Conditions 67 100 IC = 16A 11 16 nC VCC = 400V See Fig.8 25 37 VGE = 15V 60 42 TJ = 25C ns 160 250 IC = 16A, VCC = 480V 80 120 VGE = 15V, RG = 23 0.60 Energy losses include "tail" 0.58 mJ and diode reverse recovery 1.18 1.6 See Fig. 9,10,14 s VCC = 360V, TJ = 125C VGE = 15V, RG = 10 , VCPK < 500V 58 TJ = 150C, See Fig. 10,11,18 42 IC = 16A, VCC = 480V ns 210 VGE = 15V, RG = 23 160 Energy losses include "tail" 1.69 mJ and diode reverse recovery 7.5 nH Measured 5mm from package 920 VGE = 0V 110 pF VCC = 30V See Fig. 7 27 = 1.0MHz 42 60 ns TJ = 25C See Fig. 80 120 TJ = 125C 14 IF = 12A 3.5 6.0 A TJ = 25C See Fig. 5.6 10 TJ = 125C 15 VR = 200V 80 180 nC TJ = 25C See Fig. 220 600 TJ = 125C 16 di/dt = 200As 180 A/s TJ = 25C See Fig. 160 TJ = 125C 17
2
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IRG4IBC30KDPBF
12
For both:
10
LOAD CURRENT (A)
8
Square wave:
Duty cycle: 50% TJ = 125C Tsink = 90C Gate drive as specified
Power Dissipation = 13 W
6
60% of rated voltage
I
4
2
Ideal diodes
0
0.1
1
10
100
f, Frequency (KHz)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
100
I C , Collector-to-Emitter Current (A)
TJ = 150 o C
10
I C , Collector-to-Emitter Current (A)
TJ = 25 o C
TJ = 150 o C
10
TJ = 25 oC
1
1
0.1
V GE = 15V 20s PULSE WIDTH
1 10
0.1
V CC = 50V 5s PULSE WIDTH
5 10 15
VCE , Collector-to-Emitter Voltage (V)
VGE , Gate-to-Emitter Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
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3
IRG4IBC30KDPBF
20
4.0
Maximum DC Collector Current(A)
15
VCE , Collector-to-Emitter Voltage(V)
VGE = 15V 80 us PULSE WIDTH
IC = 32 A
3.0
10
IC = 16 A
2.0
IC = 8.0A 8A
5
0
25
50
75
100
125
150
1.0 -60 -40 -20
0
20
40
60
80 100 120 140 160
TC , Case Temperature ( C)
, Junction Temperature ( C) TTJ Junction Temperature ( C) J,
Fig. 4 - Maximum Collector Current vs. Case Temperature
Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
10
Thermal Response (Z thJC )
D = 0.50 1 0.20 0.10 0.05 0.1 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.001 0.01 0.1 1 10
0.01 0.00001
0.0001
t1 , Rectangular Pulse Duration (sec)
Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4IBC30KDPBF
1500 1200
VGE , Gate-to-Emitter Voltage (V)
100
VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc
20
VCC = 400V I C = 16A
16
C, Capacitance (pF)
900
Cies
12
600
8
300
Coes Cres
4
0
1
10
0
VCE , Collector-to-Emitter Voltage (V)
0
20
40
60
80
QG , Total Gate Charge (nC)
Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage
Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage
1.50
Total Switching Losses (mJ)
Total Switching Losses (mJ)
V CC = 480V V GE = 15V TJ = 25 C 1.40 I C = 16A
10
RG = Ohm 23 VGE = 15V VCC = 480V
IC = 32 A
1.30
IC = 16 A
1
IC = 8.0A 8A
1.20
1.10
1.00
0
R Gate Resistance ) RG G, ,Gate Resistance ((Ohm)
10
20
30
40
50
0.1 -60 -40 -20
0
20
40
60
80 100 120 140 160
TJ , Junction Temperature ( C )
Fig. 9 - Typical Switching Losses vs. Gate Resistance
Fig. 10 - Typical Switching Losses vs. Junction Temperature
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5
IRG4IBC30KDPBF
5.0
Total Switching Losses (mJ)
3.0
I C , Collector Current (A)
RG TJ VCC 4.0 VGE
= 23 Ohm = 150 C = 480V = 15V
100
VGE = 20V T J = 125 o C
10
2.0
1.0
0.0
0
8
16
24
32
40
1
SAFE OPERATING AREA
1 10 100 1000
I C , Collector-to-emitter Current (A)
VCE , Collector-to-Emitter Voltage (V)
Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current
100
Fig. 12 - Turn-Off SOA
Instantaneous Forward Current - I F (A)
TJ = 150C
10
TJ = 125C TJ = 25C
1 0.4
0.8
1.2
1.6
2.0
2.4
Forward Voltage Drop - V FM (V)
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4IBC30KDPBF
160
100
VR = 200V TJ = 125C TJ = 25C
120
VR = 200V TJ = 125C TJ = 25C
I F = 24A I F = 12A
80
I IRRM - (A)
I F = 24A
10
t rr - (ns)
I F = 12A IF = 6.0A
I F = 6.0A
40
0 100
di f /dt - (A/s)
1000
1 100
di f /dt - (A/s)
1000
Fig. 14 - Typical Reverse Recovery vs. dif/dt
600
Fig. 15 - Typical Recovery Current vs. dif/dt
10000
VR = 200V TJ = 125C TJ = 25C
VR = 200V TJ = 125C TJ = 25C
400
di(rec)M/dt - (A/s)
1000
Q RR - (nC)
IF = 6.0A
I F = 24A
200
I F = 12A
I F = 12A
100
IF = 6.0A
IF = 24A
0 100
di f /dt - (A/s)
1000
10 100
di f /dt - (A/s)
1000
Fig. 16 - Typical Stored Charge vs. dif/dt
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
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7
IRG4IBC30KDPBF
Same type device as D.U.T.
90% Vge +Vge
Vce
80% of Vce
430F D.U.T.
Ic 10% Vce 90% Ic Ic 5% Ic td(off) tf
Fig. 18a - Test Circuit for Measurement of ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
Eoff =
t1+5S Vce Ic Vceic dtdt
t1
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
GATE VOLTAGE D.U.T. 10% +Vg +Vg
Ic
trr
Qrr =
trr id dt Ic dt tx
tx 10% Vcc Vce Vcc 10% Ic 90% Ic DUT VOLTAGE AND CURRENT Ipk
10% Irr Vcc
Vpk
Irr
Ic DIODE RECOVERY WAVEFORMS
td(on)
tr
5% Vce t2 Vce Ic Eon = Vce ie dtdt t1 t2 DIODE REVERSE RECOVERY ENERGY t3
t4 Erec = Vd idIc dt Vc dt t3
t1
t4
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
8
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IRG4IBC30KDPBF
Vg GATE SIGNAL DEVICE UNDER TEST CURRENT D.U.T.
VOLTAGE IN D.U.T.
CURRENT IN D1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
L 1000V 50V 6000F 100V Vc*
D.U.T.
RL= 0 - 480V
480V 4 X IC @25C
Figure 19. Clamped Inductive Load Test Circuit
Figure 20. Pulsed Collector Current Test Circuit
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9
IRG4IBC30KDPBF
Notes:
Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20) VCC=80%(VCES), VGE=20V, L=10H, RG= 23 (figure 19) Pulse width 80s; duty factor 0.1%. Pulse width 5.0s, single shot. Uses IRG4BC30KD data and test conditions
TO-220 Full-Pak Package Outline
Dimensions are shown in millimeters (inches)
TO-220 Full-Pak Part Marking Information
E X AM P L E : T H IS IS AN IR F I8 4 0 G W IT H AS S E M B L Y L O T CO D E 3 4 3 2 AS S E M B L E D O N W W 2 4 1 9 9 9 IN T H E AS S E M B L Y L IN E "K " IN T E R N AT IO N AL R E C T IF IE R L OGO AS S E M B L Y L OT CODE P AR T N U M B E R
IR F I8 4 0 G 924K 34 32
Note: "P" in assembly line position indicates "Lead-Free"
D AT E C O D E Y E AR 9 = 1 9 9 9 W E E K 24 L IN E K
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.07/04
10
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Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/


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